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MCZ33199 19R154C TOP261LN HRW37F 12DT3 TDA98 0PFTN N74F649D
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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
8-Bit Serial-Input/ Parallel-Output Shift Register
High-Performance Silicon-Gate CMOS
The MC54/74HC164 is identical in pinout to the LS164. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. The MC54/74HC164 is an 8-bit, serial-input to parallel-output shift register. Two serial data inputs, A1 and A2, are provided so that one input may be used as a data enable. Data is entered on each rising edge of the clock. The active-low asynchronous Reset overrides the Clock and Serial Data inputs. * * * * * * Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2 to 6 V Low Input Current: 1 A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 244 FETs or 61 Equivalent Gates
MC54/74HC164
Do Not Use for New Designs
THIS DEVICE WILL BE SUPERCEDED BY MC54/74HC164A IN THE SECOND QUARTER OF 1996
14 1
J SUFFIX CERAMIC PACKAGE CASE 632-08
14 1
N SUFFIX PLASTIC PACKAGE CASE 646-06
14 1
D SUFFIX SOIC PACKAGE CASE 751A-03
ORDERING INFORMATION
LOGIC DIAGRAM
SERIAL DATA INPUTS 1 2 DATA
A1 A2
3 4 5 6 10 11 12 CLOCK 8 13
MC54HCXXXJ MC74HCXXXN MC74HCXXXD QA QB QC QD QE QF QG QH PARALLEL DATA OUTPUTS
Ceramic Plastic SOIC
PIN ASSIGNMENT
A1 A2 QA QB QC QD GND 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC QH QG QF QE RESET CLOCK
RESET
9
PIN 14 = VCC PIN 7 = GND
FUNCTION TABLE
Inputs Outputs Reset Clock A1 A2 QA QB ... QH L X X X L L...L H X X No Change H H D D QAn ... QGn H D H D QAn ... QGn D = data input QAn - QGn = data shifted from the preceding stage on a rising edge at the clock input.
10/95
(c) Motorola, Inc. 1995
3-1
REV 7
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* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C Ceramic DIP: - 10 mW/_C from 100_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
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MAXIMUM RATINGS*
MOTOROLA
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
RECOMMENDED OPERATING CONDITIONS
MC54/74HC164
Symbol
Vin, Vout
Symbol
Symbol
VCC
Vout
Tstg
ICC
Iout
VCC
Vin
PD
TL
VOH
tr, tf
Iin
VOL
Iin ICC
TA
VIH
VIL
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) (Ceramic DIP)
Storage Temperature
Power Dissipation in Still Air, Plastic or Ceramic DIP SOIC Package
DC Supply Current, VCC and GND Pins
DC Output Current, per Pin
DC Input Current, per Pin
DC Output Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Input Rise and Fall Time (Figure 1)
Operating Temperature, All Package Types
DC Input Voltage, Output Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Maximum Quiescent Supply Current (per Package)
Maximum Input Leakage Current
Maximum Low-Level Output Voltage
Minimum High-Level Output Voltage
Maximum Low-Level Input Voltage
Minimum High-Level Input Voltage
Parameter
Parameter
Parameter
Vin = VIH or VIL |Iout| 20 A
Vin = VIH or VIL |Iout| 20 A
Vin = VCC or GND Vin = VCC or GND Iout = 0 A
Vin = VIH or VIL |Iout| |Iout|
Vin = VIH or VIL |Iout| |Iout|
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
v
v
v
v
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
Test Conditions
- 0.5 to VCC + 0.5
- 1.5 to VCC + 1.5
3-2 - 65 to + 150 - 0.5 to + 7.0 - 55 Min 2.0 Value
v 4.0 mA v 5.2 mA
v 4.0 mA v 5.2 mA
0 0 0
0
50
25
20
260 300
750 500
+ 125
1000 500 400
VCC
Max
6.0
VCC V
6.0
6.0
4.5 6.0
2.0 4.5 6.0
4.5 6.0
2.0 4.5 6.0
2.0 4.5 6.0
2.0 4.5 6.0
Unit
Unit
mW
mA
mA
mA
_C
_C
_C
ns
V
V
V
V
V
- 55 to 25_C
0.1
1.5 3.15 4.2
0.26 0.26
3.98 5.48
0.1 0.1 0.1
1.9 4.4 5.9
0.3 0.9 1.2
8
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Guaranteed Limit
v 85_C v 125_C
High-Speed CMOS Logic Data DL129 -- Rev 6 1.0 1.5 3.15 4.2 0.33 0.33 3.84 5.34 0.1 0.1 0.1 1.9 4.4 5.9 0.3 0.9 1.2 80
v
1.0 1.5 3.15 4.2 0.40 0.40 3.70 5.20 0.1 0.1 0.1 1.9 4.4 5.9 0.3 0.9 1.2
160
v
Unit
A A V V V V
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NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). * Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTES: 1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). 2. Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Symbol tPLH, tPHL tTLH, tTHL tPHL fmax Cin Maximum Input Capacitance Maximum Output Transition Time, Any Output (Figures 1 and 4) Maximum Propagation Delay, Reset to Q (Figures 2 and 4) Maximum Propagation Delay, Clock to Q (Figures 1 and 4) Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) Parameter VCC V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 -- - 55 to 25_C 205 41 35 175 35 30 6.0 30 35 10 75 15 13 Guaranteed Limit
High-Speed CMOS Logic Data DL129 -- Rev 6
TIMING REQUIREMENTS (Input tr = tf = 6 ns)
Symbol
CPD
trec
tr, tf
tsu
tw
tw
th
Power Dissipation Capacitance (Per Package)*
Maximum Input Rise and Fall Times (Figure 1)
Minimum Pulse Width, Reset (Figure 2)
Minimum Pulse Width, Clock (Figure 1)
Minimum Recovery Time, Reset Inactive to Clock (Figure 2)
Minimum Hold Time, Clock to A1 or A2 (Figure 3)
Minimum Setup Time, A1 or A2 to Clock (Figure 3)
Parameter
3-3 VCC V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 - 55 to 25_C Typical @ 25C, VCC = 5.0 V 1000 500 400 80 16 14 80 16 14 50 10 9 5 5 5 5 5 5 Guaranteed Limit 1000 500 400 100 20 17 100 20 17 255 51 43 220 44 37 140 4.8 24 28 65 13 11 10 95 19 16 5 5 5 5 5 5 1000 500 400 120 24 20 120 24 20 310 62 53 265 53 45 110 22 19 4.0 20 24 75 15 13 10 5 5 5 5 5 5
v 85_C v 125_C
v 85_C v 125_C
MC54/74HC164
MOTOROLA MHz Unit Unit pF pF ns ns ns ns ns ns ns ns ns
MC54/74HC164
PIN DESCRIPTIONS
INPUTS A1, A2 (Pins 1, 2) Serial Data Inputs. Data at these inputs determine the data to be entered into the first stage of the shift register. For a high level to be entered into the shift register, both A1 and A2 inputs must be high, thereby allowing one input to be used as a data-enable input. When only one serial input is used, the other must be connected to VCC. Clock (Pin 8) Shift Register Clock. A positive-going transition on this pin shifts the data at each stage to the next stage. The shift register is completely static, allowing clock rates down to DC in a continuous or intermittent mode. OUTPUTS QA - QH (Pins 3, 4, 5, 6, 10, 11, 12, 13) Parallel Shift Register Outputs. The shifted data is presented at these outputs in true, or noninverted, form. CONTROL INPUT Reset (Pin 9) Active-Low, Asynchronous Reset Input. A low voltage applied to this input resets all internal flip-flops and sets Outputs QA - QH to the low level state.
SWITCHING WAVEFORMS
tr CLOCK 90% 50% 10%
tw
tf VCC GND tPHL 1/fmax tPLH tPHL Q RESET 50%
tw VCC GND
50% trec VCC
Q
90% 50% 10% tTLH tTHL
CLOCK
50% GND
Figure 1.
Figure 2.
TEST POINT VALID VCC A1 OR A2 50% GND tsu CLOCK th VCC 50% GND * Includes all probe and jig capacitance DEVICE UNDER TEST OUTPUT CL*
Figure 3.
Figure 4. Test Circuit
MOTOROLA
3-4
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HC164
EXPANDED LOGIC DIAGRAM
CLOCK
8
A1 A2
1 2 D R Q D R Q D R Q D R Q D R Q D R Q D R Q D R Q
RESET
9
3 QA
4 QB
5 QC
6 QD
10 QE
11 QF
12 QG
13 QH
TIMING DIAGRAM
CLOCK A1 A2 RESET QA QB QC QD QE QF QG QH
High-Speed CMOS Logic Data DL129 -- Rev 6
3-5
MOTOROLA
MC54/74HC164
OUTLINE DIMENSIONS
J SUFFIX CERAMIC DIP PACKAGE CASE 632-08 ISSUE Y
8
-A14
-B1 7
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMESNION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. INCHES MIN MAX 0.750 0.785 0.245 0.280 0.155 0.200 0.015 0.020 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0 15 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.94 6.23 7.11 3.94 5.08 0.39 0.50 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0 15 0.51 1.01
-TSEATING PLANE
K F G D 14 PL 0.25 (0.010) N
M
M
S
TA
J 14 PL 0.25 (0.010)
M
T
B
S
DIM A B C D F G J K L M N
N SUFFIX PLASTIC DIP PACKAGE CASE 646-06 ISSUE L
14 8
B
1 7
NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M N INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01
A F C N H G D
SEATING PLANE
L
J K M
-A-
14 8
D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F
-B-
1 7
P 7 PL
0.25 (0.010)
M
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
G C
R X 45
F
SEATING PLANE
D
14 PL
K
M
M B
S
J
0.25 (0.010)
T
A
S
DIM A B C D F G J K M P R
MILLIMETERS MIN MAX 8.75 8.55 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7 0 5.80 6.20 0.25 0.50
INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 7 0 0.228 0.244 0.010 0.019
MOTOROLA
3-6
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HC164
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High-Speed CMOS Logic Data DL129 -- Rev 6
CODELINE
3-7
*MC54/74HC164/D*
MC54/74HC164/D MOTOROLA


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